Nov. 16 Webinar Will Offer Three Unique Perspectives on the Advanced Packaging Market
proteanTecs, a global leader of deep data analytics for advanced electronics, announced the company is hosting a webinar with Yole Group and Global Unichip Corporation (GUC) on “The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging.” This 40-minute webinar will be held on Wednesday, Nov. 16 at 9 a.m. PST/ 12 p.m. EST/ 6:00 p.m. CET. To attend, register here.
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. This webinar will offer three unique perspectives on this growing ecosystem:
- Stefan Chitoraga, Technology and Market Analyst at Yole Intelligence, part of Yole Group, will present the latest market insights on the adoption of chiplets and heterogeneous integration and will address what is driving advanced packaging toward 2.5D and 3D solutions.
- Igor Elkanovich, Chief Technology Officer (CTO) at GUC will discuss the GUC GLink™ chiplet interconnect, including its architecture and roadmap; HBM3 memory interfaces; and will also highlight some of the 2.5D and 3D packaging challenges.
- Nir Sever, Senior Director of Business Development at proteanTecs will reveal silicon results from a GUC GLink chip, which integrated die-to-die (D2D) interconnect monitoring for comprehensive visibility and parametric lane grading.
The event will conclude with a Q&A session. Attendees are encouraged to come prepared with questions related to the future of chiplets, heterogeneous integration and 2.5D and 3D packaging.
Registration is now open. The live event will be recorded, and this recording will be sent to all registrants.
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