Integrated, modular solutions to address power and density challenges for AI environments will be unveiled at the 2025 OCP Global Summit
Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today announced new rack, power, and cooling technologies designed to align with Open Compute Project (OCP) design guidelines and support high-density, energy-efficient data center environments. The innovations will be featured at the 2025 OCP Global Summit, Booth #C34, October 13–16, highlighting Vertiv’s continued commitment to advancing open and flexible infrastructure for evolving AI and compute workloads.
Vertiv’s featured technologies demonstrate a broad range of OCP-aligned designs and concepts across multiple product categories. The Vertiv™ SmartIT OCP rack solution is a configurable, high-capacity rack system developed to simplify integration for system builders and support a variety of server and equipment types. The concept supports loads up to 142 kW and offers prefabricated configurations that combine validated power and cooling options for faster deployment and improved reliability.
Vertiv™ PowerIT rack power distribution units (PDUs), high-capacity systems recently released in North America and EMEA, provide up to 57.6 kW of power distribution, with monitored and switched models delivering advanced power management, load balancing, and cybersecurity features.
Vertiv™ PowerBar Track is a scalable, overhead power distribution system engineered for high-density AI and HPC environments. Its modular, open-track busbar architecture optimizes space, simplifies installation, and provides continuous power delivery. The system supports business continuity through reliable, upgradable components designed for future expansion.
Vertiv™ CoolChip Fluid Network manifolds from Vertiv’s liquid cooling portfolio will also be on display in the booth rack, illustrating flexible and efficient approaches to managing thermal loads in high-density environments. These manifolds integrate with the Vertiv™ CoolChip CDU family and reflect ongoing development of modular, adaptive cooling technologies for AI and next-generation compute architectures.
The booth will also feature Harting connectivity and cabling solutions, developed in collaboration with Vertiv, demonstrating how compact, high-performance connections can simplify integration and save space in high-density environments. These solutions efficiently distribute power from the OCP Busway through the Power Distribution Box (PDB) and into the rack, reducing installation complexity and maximizing usable rack space for IT equipment. Vertiv’s collaboration with Harting underscores its commitment to advancing reliable connectivity and open standards that benefit the broader OCP community.
“Meeting OCP standards is more than a compliance exercise; it’s about delivering infrastructure that performs at scale,” said Ramesh Menon, vice president of the IT systems business unit at Vertiv. “By integrating rack, busway, cabling, and distribution into one ecosystem, Vertiv is offering customers a faster, more reliable path to deploy AI-ready capacity across their facilities.”
Together, these technologies reinforce Vertiv’s broad portfolio across power, thermal management, IT management, integrated infrastructure, and global services. Vertiv’s presence at OCP Global Summit reflects its focus on open, efficient, and vendor-neutral systems that support the next generation of data center design.
As part of the summit agenda, Vertiv will also share its vision for future innovation. Greg Ratcliff, chief innovation officer at Vertiv, will present “From Concept to Capability: Innovating the Future of OCP Reference Designs.” The session will provide a behind-the-scenes look at how Vertiv transforms early concepts into functional prototypes and how this approach accelerates the evolution of open infrastructure. Ratcliff will highlight the role of modular, scalable designs, AI-assisted planning tools, and collaboration with OCP stakeholders in creating data centers that are more adaptive, energy-efficient, and ready for emerging workloads such as AI.
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